IC Diamond 24 Carat 4.8 Gram Thermal Compound
- SUPERIOR THERMAL PERFORMANCE- Engineered and made by 3M corporation to meet OEM specifications for the best combination of maximum performance and durability and is packaged by Innovation Cooling for retail sale
- SUPERIOR RELIABILITY- Used in mission critical applications for the military defense sector in Aviation and Naval electronics. High/Tight particle density seals in liquids and retards fluid loss lasting 3 to 4X times typical Asian retail repacks
- INTENDED USE INCLUDE but not limited to CPU,GPU Game Stations, LED Lighting, IC Packaging, Battery Thermal Management
- Contains 92% Purified synthetic diamond micronized Diamond, a natural thermal superconductor with a conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver
- Will not pump or bake out when properly used and is neither Non capacitive or electrically conductive. C of C available on Request
Electronics Grade OEM Thermal Compound with high particle purity for consistent, reliable performance.